In a context where component miniaturization, energy efficiency, and reliability are essential, advances in materials and equipment become key factors for competitiveness.
Specialized adhesives, new-generation soldering and modular equipment are enabling the industry to adapt to the growing complexity of electronic devices.
These trends were presented at the All-in-One Conference organized by Nufesa, which served as a meeting point for manufacturers and experts to discuss the upcoming challenges facing the industry.
Henkel: high-performance adhesives for demanding environments
Henkel leads innovation in solutions that increase the reliability of electronic processes:
- Structural adhesives that enable complex assemblies requiring durable bonding without compromising mechanical strength.
- Capillary underfills thatprotect critical components such as BGAs from vibrations, shocks, and extreme conditions, making them essential in sectors such as automotive and consumer electronics.
- Thermal gels with conductivities of up to 6.5 W/m·K and free of silicones, stand out for their ability to dissipate heat in high-density modules, ensuring thermal stability and long-term performance.
These solutions enable manufacturers in sectors such as healthcare, white goods, and defense to increase the useful life and efficiency of their products.
Indium: high-precision, low-temperature soldering
Indium Corporation offers solutions for the assembly of miniaturized components thanks to its ultra-thin solder pastes (types T6 and T7) that facilitate controlled and stable flow on small pads.
Its low-temperature alloys, such as Indalloy®, allow working with sensitive substrates such as flexible materials, LEDs, or sensors without the risk of thermal deformation.
With advanced jetting and dispensing techniques, these solutions help reduce defects, improve joint consistency, and increase productivity on complex assembly lines.
Essemtec: modular equipment for flexible production
Essemtec All-in-One technology responds to the demand for flexibility in modern industry. Its modular platform integrates dispensing, pick & place, rework, and inspection into a single system, facilitating a quick transition between prototyping and short-run production.
This approach is ideal for manufacturers with high mix and low volume, as it reduces setup times, minimizes line changes, and allows projects to be scaled without investing in multiple pieces of equipment.
Innovations that drive the industry forward
The combination of state-of-the-art adhesives, welds adapted to new geometries, and multifunctional equipment is redefining electronics manufacturing.
These trends offer companies the opportunity to improve reliability, reduce production times, and respond to the demand for increasingly compact and complex devices, laying the foundations for a more agile and competitive industry.
